| Job Title |
Polishing Machine Tender |
| Job Description |
Tends Abrading Machines That Polish Or Lap Surface Of
Semiconductor Wafers: Reads Work Order To Determine
Specifications. Loads Wafers Or Carriers Containing Wafers Onto
Polishing Or Lapping Machine. Adjusts Machine Controls Or Loads
Programmed Control Media In Machine To Regulate Pressure, Time,
And Slurry Flow. Starts Lapping Machine That Removes Saw Marks
And Reduces Wafer Thickness Or Starts Polishing Machine That
Polishes Wafers. Observes Machine Operation And Listens To
Sounds Of Belts, Cams, And Abrading Wheel To Detect Machine
Malfunctions. Adjusts Mechanisms Or Requests Repairs As
Necessary. Stops Machine At Prescribed Time, Removes Wafers From
Machine, And Rinses Wafers With Water To Cool Wafers And Remove
Slurry. Examines Wafers For Defects, And Measures Wafer
Thickness, Using Thickness Gauge. May Clean Wafers, Using
Chemical Solutions, Water, Or Gases, To Remove Contaminants From
Wafer Surface. May Mount Wafers Onto Carriers. May Mix Slurry.
May Tend Machine That Rounds Wafer Edges And Be Designated
Edge-round Tender (electron. Comp.). May Be Designated According
To Machine Tended As Lapping Machine Tender (electron. Comp.).
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