| Job Title |
Metallization Equipment Tender, Semiconductors |
| Job Description |
Tends Equipment That Deposits Layer Of Metal On Semiconductor
Surfaces To Provide Electrical Contact Between Circuit
Components: Places Semiconductors, Such As Silicon Wafers,
Crystal Units, Or Fiber Optic Microchannel Plates, In Container,
Using Vacuum Wand Or Tweezers. Cleans Semiconductors To Remove
Contaminants Prior To Metal Deposition, Using Chemical Baths Or
Automatic Cleaning Equipment. Loads Semiconductors Into
Metallization Equipment Holders, Using Vacuum Wand Or Tweezers.
Places Loaded Holders And Specified Metals In Chamber Of
Equipment That Deposits Layer Of Metal, Such As Aluminum, Gold,
Or Platinum, On Semiconductor Surfaces, By Sputtering Or
Evaporation Process. Manipulates Equipment Controls That Start
And Adjust Metallization Process, Following Processing
Specifications. Measures Electrical Conductivity And Thickness
Of Metal Layer On Processed Semiconductors, Using Test
Equipment. Maintains Chemicals And Metals For Equipment. May
Tend Equipment That Deposits Insulating Layer Of Glass Onto
Semiconductor Wafer Surfaces And Be Designated Glass Deposition
Tender (electron. Comp.).
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