| Job Title |
Crystal Grinder |
| Job Description |
Operates Grinding Machine To Abrade Semiconductor Crystal
Ingot To Improve Cylindrical Shape Of Ingot And Attain Specified
Diameter: Reads Work Order To Determine Target Diameter Of
Ingot. Measures Ingot Diameter, Using Calipers Or Micrometer,
And Calculates Thickness Of Material To Be Removed From Ingot
And Length Of Grinding Time. Positions And Secures Ingot In
Trunnions Or Brackets On Grinding Machine. Adjusts Machine
Controls For Position Of Grinding Tool And Speed Of Grinding.
Pushes Buttons To Activate Coolant Flow, Rotation Of Ingot,
Grinding Tool, And Timer. Measures Ingot Diameter After Grinding
And Continues Grinding To Attain Specifications For Diameter.
May Change Worn Grinding Tools And Other Parts And Adjust
Machine, Using Handtools. May Attach Graphite Pieces To Ends Of
Ingot Before Grinding, Using Epoxy, And Remove Graphite And
Epoxy From Ingot After Grinding, Using Radiant Oven And Solvent.
May Operate Saw To Cut Sample Wafer From Ingot For Inspection.
May Perform Routine Maintenance On Grinding Machine, Such As
Adding Oil And Cleaning Machine. May Operate Flat Grinding
Machine To Grind Flat Along Length Of Ingot And Be Designated
Crystal Flat Grinder (electron. Comp.).
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